Yahoo Finance

Ball Grid Array (BGA) Packaging Market Poised for Robust Growth, Fuelled by Lead-Free Technologies, IoT Advancements, and the Shift to Miniaturized Electronic Devices, with an ...

The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
Bit-Tech

AMD's AM4 socket captured on camera

The first image of AMD's upcoming Socket AM4, the new single platform for its Bristol Ridge and Zen CPU and APU products, has been leaked, revealing a pin-grid array (PGA) design with 1,331 pin ...
PC Magazine

Socket 370

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...
AZOM

Types of Semiconductor Packaging and Their Properties

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
Design-Reuse

ASE Standardizes on Ansoft Solution for IC Packaging

( BW)(ANSOFT/ASE)(ANST)(ACX) ASE Standardizes on Ansoft Solution for IC Packaging Leading Taiwanese Semiconductor Packaging Provider Relies on Ansoft Products to Ensure Their Customers' Success TAIPEI ...